Haryana Electronics System Design and Manufacturing (ESDM) Policy 2026

Notified on 27 May 2026 (Haryana Govt. Gazette Extraordinary No. 81-2026/Ext, notification No. 20/05/2026-4IB-1) for five years. It covers units manufacturing electronic products, components, sub-assemblies and modules covered by the National Policy on Electronics, M-SIPS, SPECS, the electronics PLI schemes, ECMS, the India Semiconductor Mission or other Government of India electronics schemes (indicative list in Annexure I). CAPEX Support: 30% of eligible capital expenditure in Prime/Focus and Sub-Prime Areas, 25% in Intermediate and 20% in Core Areas, up to ₹200 Crore per unit, disbursed in ten annual instalments. Eligible CAPEX includes building and infrastructure, plant and machinery including tools, dies, moulds, jigs and fixtures, IT hardware and software, captive renewable energy of at least 100 kW, ETP/waste management/air pollution control, technology acquisition (up to ₹1 Crore a year), stamp duty on sale/lease deeds, and external development charges. OPEX Support: 80% of eligible operating expenditure in Prime/Focus, 70% in Sub-Prime, 60% in Intermediate and 50% in Core Areas, for ten years from commencement, up to ₹20 Crore per unit per year — covering Net SGST and electricity duty paid to Haryana, 75% of annual lease rent (capped at 6% of the property's valuation), quality certification costs, patent costs, CGTMSE guarantee fees and further items listed in the policy. Only units that begin commercial production after the policy was notified are eligible, and the application must be made before production starts. Existing units qualify for expansion at the same location subject to the policy's additional-investment conditions. The policy also provides special incentives for startups and infrastructure-development support.